Heat dissipation is a key contributor to both the performance and reliability of electronic devices and is important to consider in system design. As components are miniaturized and packed onto smaller boards, thermal considerations become even more critical. SiTime products typically do not generate a lot of heat, yet the cooling process can still be affected by an elevated ambient or board temperature caused by adjacent highpower components. As for any other semiconductor device, the junction temperature should be maintained below the specified value for optimal performance and reliability. This application note provides essential information for our users to understand the meaning of the thermal parameters reported in the datasheets and how to use them to estimate the junction temperature under various operating conditions. The information given here is applicable to any single-junction non-ovenized device. (Most SiTime products are within this category.) See individual datasheets for the thermal considerations for OCXOs or multi-junction products.