Doc no. RR-14
Rev. B04
Package Reliability Report- UTAC 4QFN Packages
Purpose of Stress Testing
Production qualification of the 4QFN package family from UTAC which includes Chip on Lead (COL): 2.0mm X 1.6
mm, 2.5mm x 2.0mm, 3.2mm x 2.5mm, and 5.0mm x 3.2mm; and Chip on Paddle (COP): 7.0mm x 5.0mm sizes.
Results qualify UTAC's 4QFN package family for full production use for all SiTime products which use package
type 2520 ( "1"), 3225 ( "2"), 5032 ("3"), 7050 ("4") and 2016 ( "7").
Qualification Results:
MSL 1 Confirmation
Condition:
Method: JESD22-A133
125°C 24 hours, 85%RH/85°C 168 hours, 3 Reflows 260°C
Quantity Stressed:
612
Quantity Passed:
612
Failure Rate:
0
0
High Temperature Storage
Condition:
Quantity Stressed:
Method: JESD22-A103
150°C 1000 hours
429
Quantity Passed:
429
Failure Rate:
Pressure Cooker Test (Autoclave)
Method: JESD22-A102
120°C, 100% RH, 2Atm, 96 hours
375 Quantity Passed:
Condition:
Quantity Stressed:
375
Failure Rate:
Failure Rate:
0
0
Temperature Shock
Condition:
Quantity Stressed:
Method: JESD22-A106
MSL 1 preconditioning, -55°C to + 125°C, 100 cycles
315 Quantity Passed: 315
Temperature and Humidity Results (HAST)
Method: JESD22-A110
MSL 1 preconditioning, Biased HAST, Vdd (max), 130°C, 85% RH, 96 hours
449 Quantity Passed: 449 Failure Rate:
Condition:
Quantity Stressed:
0
0
Temperature Cycling
Condition:
Quantity Stressed:
Method: JESD22-A104
MSL 1 preconditioning, -65°C to + 150°C, minimum 500 cycles
380
Quantity Passed:
380
Failure Rate:
Package Information
Assembly
Factory:
UTAC Thailand
Package:
4 QFN
C194
Mold Compound:
Top Die Attach :
COL Package:
COP Package:
Wire:
Sumitomo G770H
Lead Frame:
Bottom Die Attach:
COL Package:
COP Package:
Lead Finish:
Henkle 8200T
Henkle 8200T
Au- Tanaka
Nippon NEX-130CT
Henkle 8200T
NiPdAu
RoHS/Green Compliance Documentation
MEMS Die SGS Report QI-21, QI-77
CMOS Die SGS Report QI-22
Composition Report
Package SGS Report
QI-67, QI-76, QI-78
QI-73
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