SiTime's MEMS First™ and EpiSeal™ Processes

MEMS First™ and EpiSeal™ are proprietary processes used by SiTime to manufacture very small silicon resonator die that are fully encapsulated in silicon, extremely stable, and highly durable. Because these processes use standard CMOS foundry tools and materials, they produce products are highly manufacturable with excellent quality and reliability. Moreover, production on a large wafer format results in high volume and fast volume ramping. The following sections explore the key aspects of the MEMS First and EpiSeal processes in more detail.

 

 
This document cannot be viewed on a mobile device or with increased screen zoom functions. Please download the document.