May 8th -- Sunnyvale, Calif --  Director of Packaging and Test Engineering for SiTime Corp., Pavan Gupta will explain how to leverage Standard IC Packaging for MEMS Resonators during a session focused on Advanced MEMS Packaging Trends at an annual two day technical symposium hosted by MEPTEC (Micro Electronics Packaging and Test Engineering Council), May 17, 2006 at the Hyatt San Jose. 

MEMS technology is a foundation for many mature products, such as pressure and acceleration sensors, ink jet printers and DLP displays.  It is also an enabling factor behind a broad range of emerging product in diverse industries, from aerospace, through industrial consumer, IT and automotive, to biotech.  Presentations in this session will start with an overview of high volume low-cost IC packaging technologies suitable for reuse existing and emerging large volume MEMS applications, followed by look at applying existing IC packaging technology to MEMS packaging applications.  Gupta’s presentation will conclude the session with a presentation on preparing for MEMS commercial production.

Doors open to registered attendees at 8:00am with a reception following the day’s events from 5:00 -7:00pm. 

To register or view the complete list of, exhibitors, and official schedule visit the event website.

About MEPTEC

MEPTEC (Microelectronics Packaging and Test Engineering Council) is a trade association of semiconductor suppliers and manufacturers, committed to enhancing the competitiveness of the back-end portion of the semiconductor business. We at MEPTEC are concerned exclusively with assembly and testing and are dedicated to the advancement of our industry. Since its inception over 25 years ago, MEPTEC has provided a forum for semiconductor packaging and test professionals to learn and exchange ideas that relate to assembly, test and handling.

For more information contact cd@sitime.com